Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis
S. Holzer, Ch. Hollauer, H. Ceric, S. Wagner, R. Entner, E. Langer, T. Grasser and S. Selberherr
Vienna University of Technology, AT
transient electro-thermal simulation, thermal stress, stress analysis, electromigration, transient simulation, interconnect
We introduce the combination of three-dimensional transient electro-thermal interconnect simulations for intrinsic thermo-mechanical stress problems. In order to study the development of thermal stresses we use a finite element simulator for the investigation on stresses of complex layered interconnect structures at different operating conditions. Together with the potential distribution we obtain the complete input data for accurate electromigration analysis.
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Nanotech 2005 Conference Program Abstract