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Chip Package Co-design of 5GHz RF Receiver Front-End using Multichip Module Technology

Y. Amin, H. Tenhunen, L-R Zheng, X. Duo and S. Amin
University of Engineering and Technology Taxila, PK

Keywords:
MCM, chip package co-design, front-end

Abstract:
The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A system-on-a-package (SoP) approach can solve these problems. High quality components can be integrated in the package. This paper reports a fully integrated single-package RF prototype module for a 5 GHz WLAN receiver front-end, which is intended to demonstrate the concept of SoP integration. The approach that is illustrated here is implemented with a thin film multichip module (MCM-D) interconnect technology. This technology also allows the integration of high quality passive components. With these passives, low-loss filters can be implemented.

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