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Nano Science and Technology Institute 2005 NSTI Nanotechnology Conference & Trade Show
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Application of Magnetic Neutral Loop Discharge Plasma in Deep Quartz and Silicon Etching Process for MEMS/NEMS Devices Fabrication

Y. Morikawa, T. Hayashi, K. Suu and M. Ishikawa
ULVAC, Inc., JP

Keywords:
deep etching, NLD, plasma, modulation

Abstract:
ULVAC’s Si deep etching technique has achieved high etching rate as high as 20 um/min as well as extremely high selectivity over resist mask as high as 100 or higher ensuring good etching performance.

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