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Packaging Design with Thermal Analysis of LED on Silicon Substrate

C. Tsou, Y.S. Huang, H.C. Li and T.S. Lai
Feng Chia University, TW

Keywords:
MEMS, LED, package, thermal stress

Abstract:
In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to dissipate heat and match thermal expansion coefficient (CTE). A silicon chip serves as a substrate which is formed with a depression by standard bulk micromachining and using solder ball implantation technique to fabricate metal interconnections. The objective is to develop an LED package that can overcome LED life, high operating voltage, package degradation and the ability to drive the devices at higher power and higher brightness. To numerically predict the performance of packaging design, the optical and thermal characterization of the novel package structure was evaluated and simulated by TracePro and ANSYS software respectively. Research results have shown that the silicon reflector developed can be used to achieve a tiny package with high brightness. Moreover, silicon substrate can enhance heat removal for safe junction temperature operation and minimize thermal stress caused by micmatch of CTE.

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