Nano Science and Technology InstituteNano Science and Technology Institute
Nano Science and Technology Institute 2005 NSTI Nanotechnology Conference & Trade Show
Nanotech 2005
Bio Nano 2005
Business & Investment
Nano Impact Workshop
Program
Sessions
Sunday
Monday
Tuesday
Wednesday
Thursday
Index of Authors
Index of Keywords
Keynote Presentations
Confirmed Speakers
Participating Companies
Industry Focus Sessions
Nanotech Expo
Special Symposia
Conferences
Sponsors
Exhibitors
Venue 2005
Organization
Press Room
Subscribe
Site Map
 
Nanotech 2005 At A Glance
Nanotech Proceedings
Nanotechnology Proceedings
Global Partner
nano tech
Supporting Organizations
Nanotech 2005 Supporting Organization
Media Sponsors
Nanotech 2005 Medias Sponsors
Event Contact
696 San Ramon Valley Blvd., Ste. 423
Danville, CA 94526
Ph: (925) 353-5004
Fx: (925) 886-8461
E-mail:
 
 

Numerical Investigation of Phase-Changing Heat Transfer for Laser-Assisted Direct Nano Imprint Processing

F-B Hsiao, D-B Wang, C-P Jen, Y-C Lee and C-H Chuang
National Cheng Kung University, TW

Keywords:
nanoimprinting, pulsed laser, heat conduction, phase change

Abstract:
Laser-Assisted Direct Imprinting (LADI), a novel and promising technique, has been proposed since 2002 to utilize an excimer laser to irradiate and heat the silicon surface through a highly-transparent quartz mold preloaded onto the silicon. For this fabrication, the molten depth, melting duration and preloading pressure are key issues to obtain a satisfactory imprinting pattern. The present study develops an efficient numerical method to deal with the phase-changing heat transfer during the imprinting process to acquire the effect of laser fluence for the transient response both in temperature and molten depth. According to simulation results and SEM photography, this study proposed a “fluence window” for the laser irradiation (about 0.6~0.9 J/cm^2), which guarantees not only the melting of silicon but also an undamaged shape of the quartz mold. Simulation regarding thermal-fluid-stress coupling will also be undertaken in the coming future to investigate more completely about the stuffing situation and stress concentration of silicon inside the mold during imprinting process.

Back to Program

Sessions Sunday Monday Tuesday Wednesday Thursday Authors

Nanotech 2005 Conference Program Abstract

 
Gold Sponsors
Nanotech Gold Sponsors
Silver Sponsors
Nanotech Silver Sponsors
Gold Key Sponsors
Nanotech Gold Key Sponsors
Nanotech Ventures Sponsors
Nanotech Ventures Sponsors
Sponsors
Nanotech Sponsors
News Headlines
NSTI Online Community
 
 

© Nano Science and Technology Institute, all rights reserved.
Terms of use | Privacy policy | Contact