In-plane and Out-Of-Plane Mechanical Characterization of Thin Polysilicon
F. Cacchione, B. De Masi, A. Corigliano, M. Ferrera and A. Vinay
Politecnico di Milano, IT
polysilicon, fracture, Weibull, on-chip test
In this paper is presented the mechanical characterization of thin polysilicon using different test structures. There are described two classes of on-chip test structures, with movement respectively in a plane parallel to the substrate and orthogonally to it. There are finally shown experimental results and the values obtained for Young's modulus and for rupture stringht. In this last case the results were obtained using the Weibull statistic.
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Nanotech 2005 Conference Program Abstract