Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures
P. Szabo, G. Perlaky, Gy. Bognar, Gy. Horvath, S. Ress, A. Poppe, V. Szekely, M. Rencz and B. Courtois
Budapest University of Technology and Economics, HU
characterisation, testing, MEMS
The paper will present a variety of possibilities for the thermal characterization of different movable MEMS devices and packaging. It will discuss the major difficulties in these methodologies and the ways to overcome them. Comparison of the different measurement techniques of movable Micro Electro Mechanical System (MEMS) devices and packages will be discussed as well. We will also present a methodology for the checking of the integrity of various MEMS structures by thermal transient measurements, enabling testing and diagnosis of these structures.
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Nanotech 2005 Conference Program Abstract