Engis Corporation specializes in providing innovative micro-finishing systems for applications which demand sub-micron levels of precision in surface polishing and planarization of difficult to machine materials. In the area of diamond lapping/polishing, Engis is the technology leader. The company’s line of Hyprez Microtech diamond powders, micron diamond and colloidal slurries, along with a wide array of flat lapping/polishing machines offers provides a complete systems solution for the most demanding applications.
For the emerging MEMS/Nanotechnology industry at large, Engis is pioneering the use of diamond-based CMP-D slurries to replace or augment costly traditional CMP polishing with the efficiency of precisely graded micron diamond slurries. Benefits include higher yields, higher throughputs, and lower cost easy-to-clean consumables. The process is extremely effective for polishing of chemically resistant and hard materials.
Our Pilot Production Micro-Finishing Lab provides a resource to small and start-up organizations for responsive and affordable wafer polishing services. Engis also actively seeks to cooperate and partner with leading universities and research centers which are engaged in challenging and emerging applications with requirements for surface micro-machining.