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Nano Science and Technology Institute 2004 NSTI Nanotechnology Conference & Trade Show
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Silicon Wafer Technologies

A. Usenko
Silicon Wafer Technologies, US

Keywords: silicon-on-insulator wafer, nanosize thick crystalline silicon layer

Abstract:
Silicon Wafer Technologies, Inc. is developing advanced starting wafers for semiconductor chipmakers. Our technology is commonly referred to as Silicon-On-Insulator (SOI). SOI is projected within the industry to become the dominant starting wafer for the manufacture of mainstream silicon chips by the year 2010. Product: SOI wafers. SOI wafers have a nanoscale thin surface film of single crystal silicon on an insulating film with a regular silicon wafer below. By making this silicon film only as thick as necessary and insulating it from the bulk of the silicon wafer, circuits can run faster and cooler. SOI also provides a superior platform for Microelectromechanical Systems (MEMS). Our technology can produce all industry-standard wafer sizes from 100 to 300 mm. We purchase conventional silicon wafers from traditional suppliers and process them further using our patented process into the desired sandwich SOI wafers. Advantages: By replacing silicon wafers with SOI wafers, chipmakers can move to the next generations of semiconductor chips more easily. At the current time, chips can be made using either bulk silicon or SOI. However, when chips reach the 65 nm node in about 2007, it is highly likely that SOI will be mandatory, according to International Technology Roadmap for Semiconductors. Using SOI instead of silicon results in higher speeds, suppressed cross-talk inside the chips, elimination of latch-up (an electrical fault), and increased radiation hardness of the chips.

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