Microcap Selective Packaging through Flip Chip Alignment
C.H. Chao and C.T. Pan
National Sun Yat-Sen University, TW
Keywords: flip-chip, passivation, microcap, wafer level, MEMS process
In this study, the technique of microcap selective bonding for 3-D microstructures using MEMS processes was presented. The flip-chip assembly was successfully demonstrated that the microcap transferred on the selective area of the host substrate through wafer level alignment. A new packaging technique of microcap with passivation treatment was developed for selective packaging. The metal Ni microcap is superior to those using thin film poly-silicon by surface micromachining technique due to the high stiffness structure. Photo definable material was served as the bonding adhesive layer between the silicon wafer and metal microcap. For the bonding process, several types of photo definable material were explored to characterize for bonding strength. The result shows that excellent bonding strength under bonding temperature can be achieved.
Nanotech 2004 Conference Technical Program Abstract