Properties of Self-Assembled Monolayer as an Anti-adhesion Layer on Metallic Nano Stamper
S. Choi, N. Lee, Y-J Kim and S. Kang
Yonsei University, KR
Keywords: SAM, metallic nano stamper, anti-adhesion layer, nano molding
The increasing demand for micro/nano optical components in the fields of optical data storage, optical communication, and digital display has required mass replication of polymeric micro/nano patterns. In nano replication process, surface quality can be deteriorated by the interfacial phenomena such as wettability and adhesion force between the nano mold and the replicated polymeric patterns due to high volume to surface area ratio. In this study, application of SAM (self-assembled monolayer) to nano replication process as an anti-adhesion layer was presented to reduce the surface energy between the nano mold and the replicated polymeric nano patterns. The non-electrical deposition and electorforming process were used to fabricate process, to make a metallic nano stamper. Alkanethiol SAM as an anti-adhesion layer was deposited on metallic nano stamper, using solution deposition method. To analyze wettability and adhesion force of SAM, contact angle and LFM (Lateral Force Microscopy) were measured at the actual processing temperature and pressure for the case of nano compression molding and at the actual UV-exposure time for the case of nano UV nano molding. It was found that the surface energy due to SAM deposition markedly decrease and SAM is effective under the actual molding environments.
Nanotech 2004 Conference Technical Program Abstract