Feature Length-Scale Modeling of LPCVD and PECVD MEMS Fabrication Processes
L.C. Musson, P. Ho, S.J. Plimpton and R.C. Schmidt
Sandia National Laboratories, US
Keywords: MEMS, CVD, LPCVD, PECVD, level-set method, feature scale
The surface micromachining processes used to manufacture MEMS devices and integrated circuits transpire at such small length scales and are sufficiently complex that theoretical analysis of them is particularly inviting. Under development at Sandia National Laboratories (SNL) is Chemically Induced surface Evolution with Level Sets (ChISELS), a level-set based feature-scale modeler of such processes. The theoretical models used, a description of the software and some example results are presented here. The focus to date has been of low-pressure and plasma enhanced chemical vapor deposition (LPCVD & PECVD) processes. Both are employed in SNL's SUMMiT V technology though as of this writing the PECVD process model includes only unbiased wafers. Examples of step coverage of SiO2 into a trench by each of he LPCVD and PECVD process are presented.
Nanotech 2004 Conference Technical Program Abstract