 | Nanotech 2003 Exhibitor
Hosokawa Nano Particle Technology Center
Web site: www.hosokawamicron.com/web/nano
Hosokawa Nano Particle Technology Center (USA) is a division of Hosokawa Micron International, Inc. Hosokawa Micron has developed a unique nano composites bonding technology, Mechano Chemical Bonding (MCB) system, in which materials are chemically bonded together by using mechanical energy without any binders. The MCB system is a dry continuous process with a capacity of several tons per week. This technology overcomes the cost, processing, and safety problems of nano particle applications. Application examples, such as ceramics, metals, fuel cells, superconductive materials, and carbon nano tubes, are to be presented in the exhibition.
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