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Lumped Modeling of Thermal Inkjet Print Head

Y.-S. Lee, M. S. Kim, S. Shin, S.J. Shin
CSE Center, Samsung Advanced Institute of Technology, KR

Keywords: Thermal Inkjet Print Head, Lumped Modeling, Equivalent Circuit

Abstract:
A lumped model is developed to improve the design of a thermally driven monolithic inkjet print head. The model is based on a two-dimensional heat conduction equation, an empirical pressure- temperature relation and a hydraulic flow-pressure equation. It has been simulated through the construction of an equivalent electronic circuit, and subsequently analysed using SIMULINK and a circuit simulation tool, PLECS. Using the model, efficient heater structures for a better heat treatment are proposed and validated with experimental results. Futhermore, the effects of the head geometry on drop ejection and refill of ink are analysed using the one-dimensional hydraulic model including nonlinear flow resistances.

NSTI Nanotech 2003 Conference Technical Program Abstract

 
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