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Ultra Thin Packaging of the RF-MEMS Devices with Low loss

Y.K.Park, Y.K. Kim, H.Kim, D.J. Lee, C.J.Kim, B.K.Ju
Microsystem center, Korea Institute of Science and Technology, KR

Keywords: Paackging, Ultra thin, RF-MEMS

Abstract:
RF-MEMS devices have the potential for providing an overarching circuit integration technology that can significantly reduce the size, weight and cost. In this research, as ultra thin silicon substrate which has thickness of 50um was used as capping substrate, we proposed ultra thin chip size RF-MEMS packaging technology that has vertical feed-through, ultra thin thickness (<50um), hermetic sealing and low loss. Hence, it results in high increased density with reduced volume, and the interconnection dramatically shortened which can significantly improve the performance. Also, this packaging technology can extend 3D MEMS and RF-MEMS package.

NSTI Nanotech 2003 Conference Technical Program Abstract

 
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